Semiconductor device and photomask

ABSTRACT

A semiconductor device of an embodiment includes first and second structures arranged in a first hierarchy, in which the first and second structures are repeatedly arranged in a first direction along a plane of the first hierarchy, and a distance between geometric centers of the first and second structures in a minimum unit of repetition of the first and second structures differs between a first position and a second position in the first direction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2020-141795, filed on Aug. 25, 2020; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor deviceand a photomask.

BACKGROUND

A semiconductor device has, for example, a stacked structure composed ofa plurality of hierarchies. Due to the influence of stress in each layerof the semiconductor device, misalignment may occur between thestructures arranged in different hierarchies, and poor connection mayoccur between these structures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are diagrams illustrating a schematic configurationexample of a semiconductor device according to a first embodiment;

FIG. 2 is a horizontal sectional view of a region including apenetrating contact region of the semiconductor device according to thefirst embodiment;

FIGS. 3Aa to 3Db are diagrams for describing misalignment correctionusing a photomask of the first embodiment;

FIGS. 4A and 4B are schematic views illustrating an example of theconfiguration of the photomask used in forming contacts of thesemiconductor device according to the first embodiment;

FIGS. 5A and 5B are diagrams illustrating some examples of a planearrangement of the semiconductor device according to a firstmodification example of the first embodiment;

FIG. 6 is a diagram illustrating an example of a minimum unit of thesemiconductor device according to a second modification example of thefirst embodiment;

FIGS. 7Aa to 7Cb are diagrams for describing misalignment correctionusing a photomask of a second embodiment;

FIGS. 8A and 8B are schematic views illustrating an example of aconfiguration of the photomask used in forming contacts and slits of asemiconductor device according to the second embodiment; and

FIGS. 9Aa to 9Bb are diagrams for describing misalignment correctionusing a photomask of a modification example of the second embodiment.

DETAILED DESCRIPTION

A semiconductor device of an embodiment includes first and secondstructures arranged in a first hierarchy, in which the first and secondstructures are repeatedly arranged in a first direction along a plane ofthe first hierarchy, and a distance between geometric centers of thefirst and second structures in a minimum unit of repetition of the firstand second structures differs between a first position and a secondposition in the first direction.

Hereinafter, the present invention will be described in detail withreference to the drawings. In addition, the present invention is notlimited by the embodiments described below. In addition, theconstituents in the following embodiments include those that can beeasily assumed by those skilled in the art or those that aresubstantially the same.

First Embodiment

Hereinafter, a first embodiment will be described in detail withreference to the drawings.

(Configuration Example of Semiconductor Device)

FIGS. 1A and 1B are diagrams illustrating a schematic configurationexample of a semiconductor device 1 according to the first embodiment.FIG. 1A is a sectional view of the semiconductor device 1 along an Xdirection, and FIG. 1B is a schematic plan view illustrating stress thatmay be generated in the semiconductor device 1. However, in FIG. 1A,some of upper layer wiring is omitted. Further, structures that are notpresent on the same section are also illustrated at the same time.

As illustrated in FIG. 1A, the semiconductor device 1 includes aperipheral circuit CUA and a stacked body LM on a substrate SB.

The substrate SB is a semiconductor substrate such as a siliconsubstrate. The peripheral circuit CUA including transistors TR,contacts, and the like is arranged on the substrate SB. The transistorsTR are arranged on active areas AA provided on a surface layer of thesubstrate SB. The peripheral circuit CUA is arranged below a memoryregion MR in which a plurality of memory cells are arranged, andcontributes to the operation of the memory cells as will be describedlater.

The peripheral circuit CUA is covered with an insulating layer 51.Source lines SL are arranged in a partial region on the insulating layer51. Further, the stacked body LM in which a plurality of word lines WLare stacked with the insulating layer interposed therebetween isarranged in a partial region on the insulating layer 51 via the sourcelines SL.

The stacked body LM includes memory regions MR, penetrating contactregions TPc and TPw, and a staircase region SR.

The memory regions MR are arranged in the vicinity of the center of thestacked body LM, for example. In the memory region MR, a plurality ofpillars PL that penetrate the word lines WL in a stacking direction toreach the source line SL are arranged. A plug CH for connecting thepillar PL and an upper layer wiring such as a bit line is arranged atthe upper end portion of the pillar PL. A plurality of memory cells areformed at intersections of the pillars PL and the word lines WL. Data isread and written from and to the memory cells by applying apredetermined voltage to the memory cells which are electricallyconnected to the corresponding word line WL from the word line WL, orthe like.

In this way, the semiconductor device 1 is configured as, for example, athree-dimensional non-volatile memory in which memory cells arethree-dimensionally arranged in the memory region MR.

The word lines WL are terminated stepwise at both end portions of thestacked body LM in the X direction. One end side of the word lines WL isthe staircase region SR, and the other end side thereof is a penetratingcontact region TPw.

The staircase region SR has a configuration in which the plurality ofword lines WL are led out in a staircase pattern. A contact CC thatconnects the word line WL and the upper layer wiring or the like isarranged on a terrace portion of each of the plurality of word lines WLled out in staircase pattern, and the contact CC is configured to beable to apply a predetermined voltage to the memory cells via the wordlines WL.

In this specification, a direction in which a terrace surface of eachstaircase of the staircase region SR faces is defined as an upwarddirection in the semiconductor device 1.

Each of the penetrating contact region TPw arranged on the other endside of the stacked body LM in the X direction and the penetratingcontact region TPc arranged between the memory regions MR of the stackedbody LM includes an insulating region having no word line WL.

The word line WL of the stacked body LM is a layer formed by replacing asacrificial layer made of an insulating material or the like with aconductive material. When the material is replaced, insulating regionssuch as the penetrating contact regions TPw and TPc are formed byinhibiting the replacement of the material in partial regions. In thoseinsulating regions, contacts C4 that connect the peripheral circuit CUAarranged on the substrate SB on the lower side and various kinds ofupper layer wiring and the like are arranged.

More specifically, a wiring D2 that is electrically connected to theperipheral circuit CUA via a plurality of contacts and wiring or thelike is connected to the lower end of the contact C4. The plug CH thatis electrically connected to the upper layer wiring or the like isconnected to the upper end of the contact C4.

A peripheral region PR is arranged around the stacked body LM. Theperipheral region PR is covered with an insulating layer 52 having athickness that reaches at least the height of the upper surface of thestacked body LM. However, a contact C3 that connects the peripheralcircuit CUA and the upper layer wiring or the like is also arranged inthe peripheral region PR.

More specifically, the wiring D2 that is electrically connected to theperipheral circuit CUA via a plurality of contacts and wiring or thelike is connected to the lower end of the contact C3. A plug VY that iselectrically connected to the upper layer wiring or the like isconnected to the upper end of the contact C3.

Further, a plate-like portion BP in which a groove for relaxing thestress acting between the peripheral region PR and the stacked body LMis filled with an insulating layer or the like may be arranged in theperipheral region PR. The plate-like portion BP penetrates theinsulating layer 52 in a thickness direction and extends in a Ydirection. In the semiconductor device 1 in the middle of manufacturing,the plate-like portion BP, which is a groove before being filled withthe insulating layer, separates the peripheral region PR from thestacked body LM, so that the stress from the peripheral region PR to thestacked body LM is relaxed.

FIG. 1B illustrates a stress distribution in planes PN of thesemiconductor device 1. The plane PN contains, for example, at least onestacked body LM, and includes each configuration belonging to the memoryregions MR, the staircase region SR, and the penetrating contact regionsTPc and TPw excluding the peripheral circuit CUA, among the minimumconfiguration capable of functioning as a storage circuit independently.Here, the wirings D2 connected to the contacts C4 of the penetratingcontact regions TPc and TPw may also be included in the plane PN. Thesemiconductor device 1 may include one or a plurality of planes PN. In acase where the semiconductor device 1 includes a plurality of planes PN,these planes PN can operate in parallel.

As illustrated in FIG. 1B, stress may be generated between theperipheral region PR and the plane PN due to the differences instructures and materials constituting the peripheral region PR and theplane PN. For example, at least in the stacked body LM including thesacrificial layer before being replaced with the word line WL,compressive stress toward the center of the stacked body LM is generatedas indicated by inward arrows in FIG. 1B. On the other hand, in theperipheral region PR in which the thick insulating layer 52 is arranged,tensile stress toward the outside from the center of the peripheralregion PR is generated as indicated by outward arrows in FIG. 1B.

Due to the influence of such stress, the various structures illustratedin FIG. 1A may be misaligned from the desired formation position.Further, for example, in the contacts C3 and C4 and the like connectingthe structures between a plurality of different hierarchies, poorconnection may occur at one or both of the connection with the wiring D2on the lower layer and the connection with the plugs VY and CH on theupper layer.

In the example of FIG. 1A, the different hierarchies include, forexample, a hierarchy HIb as a first hierarchy including the stacked bodyLM, a hierarchy HIa as a second hierarchy which is positioned below thehierarchy HIb, is interposed between a hierarchy including theperipheral circuit CUA and the hierarchy HIb, and is composed of theinsulating layer 51 including the wiring D2, and a hierarchy HIc as athird hierarchy which is an upper layer of the hierarchy HIb includingthe stacked body LM and includes the plugs VY and CH and the like.

Further, the minimum configuration capable of independently functioningas a storage circuit, or more broadly, a semiconductor circuit asdescribed above is the configuration illustrated in FIG. 1A, taking thesemiconductor device 1 of the first embodiment as an example. That is,FIG. 1A includes the memory regions MR in which the memory cells arearranged, the peripheral circuit CUA contributing to the operation ofthose memory cells, and various kinds of wiring including the word linesWL, contacts C4 and C3, and the like which electrically connect thememory cells and the peripheral circuit CUA. With these configurations,the configuration illustrated in FIG. 1A can be the minimumconfiguration capable of independently functioning as a semiconductorcircuit. The configuration illustrated in FIG. 1A is also referred to asan independent operating element in the semiconductor device 1 of thefirst embodiment. The semiconductor device 1 of the first embodimentincludes at least one independent operating element.

The structure of the first embodiment can be applied to, for example,the connection structure with the contacts C4, the wirings D2, and theplugs CH in the penetrating contact regions TPc and TPw, and theconnection structure with the contacts C3, the wirings D2, and the plugsVY in the peripheral region PR described above. Hereinafter, theconnection structure with the contacts C4, the wirings D2, and the plugsCH in the penetrating contact region TPc will be described as anexample.

(Example of Misalignment Correction of Semiconductor Device)

FIG. 2 is a horizontal sectional view of a region including thepenetrating contact region TPc of the semiconductor device 1 accordingto the first embodiment. As illustrated in FIG. 2 , the region includingthe penetrating contact region TPc constitutes a plurality of minimumunits RU in which the contacts C4 as a first structure are repeatedlyarranged in the Y direction.

One minimum unit RU is interposed between two contacts LI as a secondstructure that are at both end portions in the Y direction, and includesthe contacts C4, plate-like portions BR, and columnar portions HR whichare arranged in the penetrating contact region TPc, the pillars PLarranged in the memory region MR, and separation layers SHE arranged inthe penetrating contact region TPc and the memory regions MR. Althoughnot illustrated in FIG. 2 , the minimum unit RU also includes thewirings D2 as a third structure and the plugs CH as a fourth structurewhich are connected to the contacts C4. In addition, the two contacts LIthat partition one minimum unit RU may be included in the minimum unitRU.

The contact LI has a longitudinal direction in the X direction, and hasa structure in which a slit that penetrates the stacked body LM to reachthe source line SL is filled with a conductive layer having a liner ofan insulating layer. The slits where the contacts LI are formed separatethe stacked body LM in the Y direction to form a block in the plane PNof the semiconductor device 1. In the semiconductor device 1 at the timeof manufacturing, the sacrificial layer of the stacked body LM isremoved by a removal liquid or the like through the slit before beingfilled with the conductive layer. Further, a conductive material gas issupplied into the gap obtained by the removal of the sacrificial layerof the stacked body LM, through the slit so that the word line WL isformed.

The conductive layer of the contact LI is connected to the upper layerwiring or the like via the plug CH. Here, the plug CH connected to thecontact LI may be referred to as the plug CH as a fifth structure, andmay be distinguished from the plug CH as the fourth structure connectedto the contact C4 described above. Further, the plug CH connected to thepillar PL may be referred to as the plug CH as a sixth structure and maybe distinguished from other plugs CH.

As described above, in the semiconductor device 1 after manufacturing,the contact LI functions as a source line contact by the structureconnected to the upper layer wiring or the like. However, instead of thecontact LI, a structure that is not connected to the plug CH and doesnot function as a source line contact may be formed by filling the slitwith the insulating layer or the like.

The separation layer SHE that separates one or a plurality of conductivelayers including at least the uppermost conductive layer among theconductive layers formed in the stacked body LM by the replacement withthe sacrificial layer is arranged between the two contacts LI. Theseparation layer SHE extends in the X direction, and partitions one or aplurality of conductive layers of the stacked body LM into a pattern ofselect gate lines SGD arranged on both sides of the separation layer SHEin the Y direction.

That is, the select gate line SGD is arranged on the upper layer of theplurality of word lines WL of the stacked body LM. The select gate linemay also be arranged on a lower layer of the plurality of word lines WLof the stacked body LM. FIG. 2 illustrates a horizontal section of thestacked body LM at the height position of the select gate line SGD.

Select gates (not illustrated) are formed at the intersections ofpillars PL and the select gate lines SGD on the upper layer and theselect gate lines on the lower layer, and by turning these select gateson or off, the memory cells of the pillars PL to which these selectgates belong are selected or unselected.

As described above, the contact C4 is arranged in an insulating regionNR including the sacrificial layer of which the replacement with theconductive material is inhibited. In the example of FIG. 2 , a pluralityof contacts C4 arranged in the X direction are arranged within theinsulating region NR. However, a plurality of contacts C4 may bearranged in the Y direction instead of or in addition to the Xdirection.

The plate-like portion BR that inhibits the replacement of thesacrificial layer with the word line WL or the like is arranged at eachof both end portions of the insulating region NR in the Y direction. Theplate-like portion BR has a longitudinal direction in the X direction,and penetrates the stacked body LM to reach the source line SL. Theinside of the plate-like portion BR is filled with an insulating layer.

By such a structure, when the sacrificial layer is replaced with theword line WL or the like, the plate-like portion BR inhibits the inflowof the removal liquid of the sacrificial layer and the conductivematerial gas from the slit to the insulating region NR, and theinsulating region NR is secured in a partial region of the stacked bodyLM. By arranging the contact C4 in the insulating region NR, forexample, it is possible to suppress the occurrence of electricalconduction between the contact C4 and the word line WL.

A plurality of columnar portions HR are arranged in the penetratingcontact region TPc excluding the insulating region NR. The columnarportion HR penetrates the stacked body LM to reach the source line SL.The inside of the columnar portion HR is filled with, for example, aninsulating layer or the like.

As described above, when the sacrificial layer is replaced with the wordline WL or the like, the stacked body LM has a fragile structure havinga gap between the insulating layers. At this time, the columnar portionHR functions as a support for supporting the stacked body LM in thepenetrating contact region TPc. In addition, the plurality of columnarportions HR may be arranged in the above-described staircase region SR,and these columnar portions HR may function as supports for supportingthe staircase region SR. The arrangement of the columnar portions HR maybe an orthogonal lattice-like (matrix-like) or staggered periodicarrangement, an arrangement in which a part of the above-describedperiodic arrangement is missing, an arrangement of which the period ispartially different from the above-described periodic arrangement, orthe like.

As described above, the plurality of pillars PL are arranged in thememory regions MR. The memory cells are formed at the intersections ofthe plurality of pillars PL and the plurality of word lines WL, and whenthe sacrificial layer is replaced with the word line WL or the like, thepillars PL function as supports for supporting the stacked body LM inthe memory regions MR. The arrangement of the pillars PL is atwo-dimensional periodic lattice-like arrangement. From the viewpoint ofthe accumulation density of memory cells, the staggered arrangement isefficient as the arrangement of pillars PL.

The above-described configuration is formed by, for example, forming aphotoresist film or the like having a pattern of each structure on thestacked body LM a plurality of times, and repeating a process oftransferring the pattern to the stacked body LM. The pattern formationon the photoresist film or the like is performed by, for example,applying an exposure light through a photomask to expose a part of thephotoresist film or the like to light.

FIGS. 3Aa to 3Cb are diagrams for describing the misalignment correctionusing the photomask of the first embodiment.

FIG. 3Aa is a diagram schematically illustrating a top view ofphotomasks without misalignment correction, and a top view and asectional view of each structure formed in a case of using thephotomasks. In FIG. 3Aa, the top views of the photomasks and eachstructure schematically illustrate a state of one end portion in the Ydirection within the plane PN, an intermediate position between the oneend portion and a center portion within the plane PN, the center portionwithin the plane PN, an intermediate position between the center portionand the other end portion within the plane PN, and the other end portionin the Y direction within the plane PN, from the upper side in thevertical direction.

As illustrated in FIG. 3Aa, wiring patterns D2 p on the photomask forforming the wirings D2 are arranged at substantially equal intervals inthe Y direction in one plane PN. Similarly, contact patterns C4 p on thephotomask for forming the contacts C4 and plug patterns CHp on thephotomask for forming the plugs CH are also arranged at substantiallyequal intervals in the Y direction in one plane PN.

Further, on these photomasks, the interval between the wiring patternsD2 p, the interval between the contact patterns C4 p, and the intervalbetween the plug patterns CHp are substantially equal. Therefore, whenthese photomasks are superposed, the positions of the geometric centersof the wiring pattern D2 p, the contact pattern C4 p, and the plugpattern CHp substantially match at any position in the Y directionwithin the plane PN.

However, when these photomasks are used to sequentially form the wiringsD2, the contacts C4, and the plugs CH on the substrate SB, themisalignment amount in the wirings D2, the contacts C4, and the plugs CHis increased as being toward both end portions of the plane PN in the Ydirection.

This is because the stress acting within the plane PN changes in each ofthe hierarchies HIa to HIc while the wirings D2, the contacts C4, andthe plugs CH are sequentially formed, and the structures formed at equalintervals are misaligned. As a result, the intervals between thepatterns which were equal to each other in the photomask, becomedifferent between the structures on the actual substrate SB. Therefore,the positions of the geometric centers between the structures do notmatch.

In the example of FIG. 3Aa, on the substrate SB, the stress is canceledin the vicinity of the center in the Y direction within the plane PN,and the positions of the geometric centers of the wiring D2, the contactC4, and the plug CH substantially match. However, the interval betweenthe contacts C4 is increased more than the interval between the wiringsD2, and the interval between the plugs CH is increased more than theinterval between the contacts C4. Therefore, the distance between thegeometric centers of the contact C4 and the wiring D2 and the distancebetween the geometric centers of the contact C4 and the plug CH are bothincreased as being toward both end portions in the Y direction withinthe plane PN.

Referring to the A-A section of one end portion of the plane PN in the Ydirection, the contact C4 is connected to the wiring D2 at a positionshifted outward in the Y direction from the center position of thewiring D2, and the plug CH is barely connected to the end portion of thecontact C4 on the outer side in the Y direction.

FIG. 3Ab is a graph schematically illustrating the misalignment amountof each structure in a case of using the photomasks without misalignmentcorrection. The horizontal axis of the graph is the Y coordinateposition in the plane PN, and the vertical axis is the misalignmentamount in the Y direction.

As illustrated in FIG. 3Ab, in the vicinity of the center in the Ydirection within the plane PN, the positions of the geometric centers ofthe wiring D2, the contact C4, and the plug CH substantially match, andtherefore a misalignment amount MSb between the contact C4 and thewiring D2 and a misalignment amount MSt between the contact C4 and theplug CH both have the lowest value.

However, the misalignment amounts MSb and MSt are both increased asbeing toward both end portions in the Y direction within the plane PN.Therefore, although the misalignment amount MSb remains within adesigned tolerance AVb of the misalignment amount MSb, the misalignmentamount MSt deviates from a designed tolerance AVt of the misalignmentamount MSt at both end portions in the Y direction.

FIG. 3Ba is a diagram schematically illustrating a top view ofphotomasks in which the misalignment of the contacts C4 with respect tothe plugs CH is 100% corrected, and a top view and a sectional view ofeach structure formed in a case of using the photomasks.

As illustrated in FIG. 3Ba, the wiring patterns D2 p on the photomaskfor forming the wirings D2 and the plug patterns CHp on the photomaskfor forming the plugs CH are arranged at substantially equal intervalsin the Y direction in one plane PN. Further, on these photomasks, theinterval between the wiring patterns D2 p, and the interval between theplug patterns CHp are substantially equal.

On the other hand, the contact patterns C4 p on the photomask forforming the contacts C4 are 100% corrected according to the positions ofthe plugs CH on the substrate SB in the actual semiconductor device 1.In this case, the correction amount of the contact patterns C4 p is setto substantially match the misalignment amount between the contact C4and the plug CH in a case where correction is not performed.

The position of the plug CH may be determined on the basis of designdata, and may be estimated on the basis of a statistical value obtainedfrom the prototype or the like of the semiconductor device 1 or asimulation value considering the stress that may occur in thesemiconductor device 1, as needed.

By 100% correcting the contact patterns C4 p to the positions of theplugs CH, the interval between the contact patterns C4 p on thephotomask is increased as being toward the positions corresponding toboth sides of the plane PN in the Y direction more than the intervalbetween the wiring patterns D2 p and the interval between the plugpatterns CHp on other photomasks.

In this manner, when these photomasks are superposed, the positions ofthe geometric centers of the wiring patterns D2 p and the plug patternsCHp substantially match at any position in the Y direction within theplane PN, and only the positions of the geometric centers of the contactpatterns C4 p are shifted outward in the Y direction as being towardboth sides in the Y direction within the plane PN.

When these photomasks are used to sequentially form the wirings D2, thecontacts C4, and the plugs CH on the substrate SB, since the positionsof the contacts C4 are adjusted to match the positions of the plugs CH,the plug CH is connected to the substantially center position of thecontact C4 over the entire position in the Y direction within the planePN.

However, since the contacts C4 are arranged outward in accordance withthe plugs CH, the misalignment amount between the contact C4 and thewiring D2 is increased as being toward both end portions of the plane PNin the Y direction.

Referring to the A-A section of one end portion of the plane PN in the Ydirection, although the plug CH is connected to the substantially centerposition of the contact C4, a part of the lower end of the contact C4deviates to the outside of the wiring D2 in the Y direction.

FIG. 3Bb is a graph schematically illustrating the misalignment amountof each structure in a case of using the photomasks in which themisalignment of the contacts C4 with respect to the plugs CH is 100%corrected.

As illustrated in FIG. 3Bb, the misalignment amount MSt between thecontact C4 and the plug CH has the lowest value over the entire positionin the Y direction in the plane PN. However, the misalignment amount MSbbetween the contact C4 and the wiring D2 is increased as being towardboth end portions in the Y direction within the plane PN, and greatlydeviates from the designed tolerance AVb of the misalignment amount MSbat both end portions in the Y direction.

FIG. 3Ca is a diagram schematically illustrating a top view ofphotomasks in which the misalignment of the contacts C4 with respect tothe plugs CH is 40% corrected, and a top view and a sectional view ofeach structure formed in a case of using the photomasks.

As illustrated in FIG. 3Ca, the wiring patterns D2 p on the photomaskfor forming the wirings D2 and the plug patterns CHp on the photomaskfor forming the plugs CH are arranged at substantially equal intervalsin the Y direction in one plane PN, and the interval between the wiringpatterns D2 p and the interval between the plug patterns CHp aresubstantially equal.

On the other hand, the contact patterns C4 p on the photomask forforming the contacts C4 are arranged at positions which are corrected tothe positions of the plugs CH on the substrate SB in the actualsemiconductor device 1 with a correction factor of less than 100%.

By correcting the contact patterns C4 p to the positions of the plugs CHby less than 100%, the interval between the contact patterns C4 p on thephotomask is smaller than that in the case of the above-described 100%correction and is increased more than the interval between the wiringpatterns D2 p and the interval between the plug patterns CHp on otherphotomasks, as being toward both end portions of the plane PN in the Ydirection.

In the example of FIG. 3Ca, the correction factor of the contact patternC4 p with respect to the plug CH is set to, for example, 40%. In a casewhere the contact pattern C4 p is corrected with respect to the plug CHby, for example, 40%, the correction amount of the contact patterns C4 pis set to be 40% of the misalignment amount between the contact C4 andthe plug CH in a case where correction is not performed.

Among the photomasks for forming the contacts C4 illustrated in FIGS.3Aa, 3Ba, and 3Ca, the photomask illustrated in FIG. 3Ca corresponds tothe photomask of the first embodiment.

When these photomasks illustrated in FIG. 3Ca are used to sequentiallyform the wirings D2, the contacts C4, and the plugs CH on the substrateSB, although the center positions of the contacts C4 and the plugs CHare not perfectly aligned over the entire position in the Y directionwithin the plane PN, it is possible to avoid that the contact C4 greatlydeviates from the wiring D2.

Referring to the A-A section of one end portion of the plane PN in the Ydirection, the plug CH is connected to a position slightly shiftedoutward in the Y direction from the center position of the contact C4,and the entire lower end of the contact C4 is connected to the wiringD2.

FIG. 3Cb is a graph schematically illustrating the misalignment amountof each structure in a case of using the photomasks in which themisalignment of the contacts C4 is 40% corrected.

As illustrated in FIG. 3Cb, both the misalignment amount MSb between thecontact C4 and the wiring D2 and the misalignment amount MSt between thecontact C4 and the plug CH are respectively within the tolerance AVb andthe tolerance AVt, over the entire position in the Y direction withinthe plane PN.

In this way, instead of perfectly aligning the contacts C4 with respectto the plugs CH by the 100% correction, by aligning the contacts C4 withrespect to the plugs CH by a predetermined correction factor of lessthan 100%, both the misalignment amount between the contact C4 and thewiring D2 and the misalignment amount between the contact C4 and theplug CH can be kept within the tolerance.

In addition, in FIGS. 3Ab, 3Bb, and 3Cb described above, the change inmisalignment amount between the structures in the Y direction isrepresented by a linear graph, but each of the graphs is merely aschematic graph. Therefore, the misalignment amount between thestructures is not always changed linearly, and even in such a case, theabove correction method can be used.

The method of performing the correction by less than 100% describedabove will be described in more detail.

In the above description, the description has been focused on themisalignment correction in the Y direction within the plane PN, but theabove method can also be applied to the misalignment correction in the Xdirection. Therefore, in the following, a correction amount Δd(x,y) in acase where the contact C4 is corrected with respect to the position(x,y) of the plug CH, which is represented by the X coordinate and the Ycoordinate within the plane PN, by a predetermined ratio α (α<1) of lessthan 100% will be described.

Here, the ratio α is determined on the basis of, for example, themisalignment amount between the contact C4 and the wiring D2 on theactual substrate SB, the misalignment amount between the contact C4 andthe plug CH on the actual substrate SB, the value of the tolerance ofeach of the misalignment amounts, and the like. In some cases, themisalignment amount, the tendency of misalignment, and the like differbetween the X direction and the Y direction in the plane PN. In such acase, different ratios α may be used for the X direction and the Ydirection.

Further, in a case where a correction amount Δd₀(x,y) in a case wherethe contact C4 is 100% corrected with respect to the position (x,y) ofthe plug CH is less than a threshold value Δdth, it is desirable thatthe above correction is not implemented. The threshold value Δdth isdetermined on the basis of the value of the designed tolerance of themisalignment amount between the contact C4 and the plug CH, and thelike.

In a case where the correction amount Δd₀(x,y) at the time of the 100%correction of the contacts C4 with respect to the plugs CH is equal toor greater than the threshold value Δdth, that is, when Δd₀(x,y)≥Δdth,the value obtained by multiplying the misalignment amount exceeding thethreshold value Δdth by the ratio α is defined as the actual correctionamount Δd(x,y). Specifically, the correction amount Δd(x,y) at this timeis expressed by, for example, Equation (1) below.Δd(x,y)=Δdth+α(Δd ₀(x,y)−Δdth)  (1)

However, Equation (1) described above may be a higher-order equation.More precise correction is possible by obtaining the correction amountΔd(x,y) by a higher-order equation.

Further, according to Equation (1), there may be a region in which themisalignment correction is performed and a region in which themisalignment correction is not performed within the plane PN, regardlessof the example of FIG. 3Cb described above. That is, in a case where aregion in which the correction amount Δd₀(x,y) at the time of the 100%correction of the contacts C4 with respect to the plugs CH is less thanthe threshold value Δdth (Δd₀(x,y)<Δdth) is present within the plane PN,the misalignment correction in that region with respect to the contactC4 is not performed. An example is illustrated in FIGS. 3Da and 3Db.

In the example illustrated in FIG. 3Db, a region within a predetermineddistance from the center toward the end portions in the Y directionwithin the plane PN is a region in which the misalignment correction isnot performed since the correction amount Δd₀(x,y) is less than thethreshold value Δdth. As described above, the threshold value Δdth isdetermined on the basis of, for example, the value of the designedtolerance AVt of the misalignment amount MSt between the contact C4 andthe plug CH, and the like. Therefore, in a case where the correctionamount Δd₀(x,y) is less than the threshold value Δdth, it is possible tosuppress that the misalignment amount MSt exceeds the tolerance AVt evenin a case where the correction is not performed.

On the other hand, regions from the predetermined distance to the endportions in the Y direction within the plane PN are regions in which themisalignment correction is performed because the correction amountΔd₀(x,y) is equal to or greater than the threshold value Δdth. Since themisalignment of the contact C4 with respect to the plug CH is corrected,the inclination of the misalignment amount MSt, which tends to rise fromthe center to the end portions in the Y direction within the plane PN,becomes gentle. On the other hand, the inclination of a misalignmentamount MSb, which also tends to rise from the center to the end portionin the Y direction within the plane PN, becomes steeper. By correctingthe misalignment of the contact C4 in this way, as illustrated in FIG.3Da, the connection between the contact C4 and the plug CH and theconnection between the contact C4 and the wiring D2 are secured even atthe end portions in the Y direction within the plane PN.

As described above, in a case where both the region in which themisalignment correction is performed and the region in which themisalignment correction is not performed are present within the planePN, the misalignment amounts MSt and MSb of the contact C4, that is,both the distance between the geometric centers of the contact C4 andthe plug CH, and the distance between the geometric centers of thecontact C4 and the wiring D2 have discontinuous points DSt and DSb wherethe change tendency is discontinuous, at the boundary between thoseregions. These discontinuous points DSt and DSb appear in the vicinityof the positions where the correction amount Δd₀(x,y) and the thresholdvalue Δdth are equal (Δd₀(x,y)=Δdth), in the Y direction within theplane PN. However, the discontinuity of the change tendency does notmean that the distance between the geometric centers changes from anincreasing tendency to a decreasing tendency, or changes from adecreasing tendency to an increasing tendency. That is, for example, theincrease or decrease of the change tendency is reversed at the centerposition in the Y direction within the plane PN, but the discontinuouspoint described here does not include such a point.

In addition, in the above description, the positions of the contacts C4on the lower layer are corrected with respect to the plugs CH on theupper layer, but the positions of the contacts C4 on the upper layer maybe corrected with respect to the wirings D2 on the lower layer by apredetermined ratio α.

In a case where the contacts C4 are formed using Equation (1) describedabove, the semiconductor device 1 of the first embodiment has at leastone of the following configurations.

That is, the misalignment amount between the contact C4 and the wiringD2 and the misalignment amount between the contact C4 and the plug CHhave a correlation. That is, the misalignment amount between the contactC4 and the wiring D2 and the misalignment amount between the contact C4and the plug CH are increased together as being toward the outer sidesof the plane PN.

In such a case, for example, at two positions in a predetermineddirection such as the X direction or the Y direction, a magnituderelationship, a magnitude ratio, and the like comparing the misalignmentamounts between the contact C4 and the wiring D2 have a correlation witha magnitude relationship, a magnitude ratio, and the like comparing themisalignment amounts between the contact C4 and the plug CH.

Here, the two positions in the predetermined direction can bearbitrarily selected, and for example, within the plane PN, the centerposition and the position of the end portion of the plane PN can beselected. However, in a case where two positions are selected across theplanes PN, it is assumed that positions other than those correspondingto each other between the planes PN are selected rather than the samepositions such as the center positions of the planes PN.

In addition, a predetermined amount of misalignment occurs between thecontact C4 and the wiring D2, and between the contact C4 and the plugCH. That is, for example, as illustrated in FIGS. 3Ba and 3Bb, in a casewhere the contact C4 is 100% corrected with respect to the plug CH, themisalignment amount between the contact C4 and the plug CH should be,for example, substantially zero. On the other hand, in a case where theabove correction is performed by less than 100%, both the misalignmentamount between the contact C4 and the wiring D2 and the misalignmentamount between the contact C4 and the plug CH have a predetermined valueother than zero.

Further, as described above, in a case where the correction amount ofthe contact C4 with respect to the plug CH is 40% or the like and thespecific gravity of the alignment accuracy of the contact C4 withrespect to the wiring D2 is increased, the misalignment amount betweenthe contact C4 and the wiring D2 is set to be within a more limitedrange, and the misalignment amount between the contact C4 and the plugCH tends to be increased as being toward the outer sides of the planePN.

However, the misalignment amount between contact C4 and wiring D2 andthe misalignment amount between contact C4 and plug CH may include themisalignment amount due to processes such as overlay (superposing)misalignment between different lithography processes or the like, inaddition to the misalignment amount affected by the stress.

The positional relationship between the contact C4 and the wiring D2,the positional relationship between the contact C4 and the plug CH, andthe like described above may be the positional relationships in a casewhere the upper end of the contact C4, the upper surface of the wiringD2, and the upper end of the plug CH are compared.

In addition, within one minimum unit RU, in a case where a plurality ofstructures are arranged in one minimum unit RU as in a case where aplurality of contacts C4 are arranged not only in the X direction butalso in the Y direction, the position of the geometric center describedabove may be the position of the geometric center in the entirety of theplurality of structures thereof.

Further, in a case where the contacts C4 are formed using Equation (1)in the above-described correction method, the photomask of the firstembodiment has, for example, the configuration illustrated in FIGS. 4Aand 4B below.

FIGS. 4A and 4B are schematic views illustrating an example of theconfiguration of a photomask 10 used in forming the contacts C4 of thesemiconductor device 1 according to the first embodiment. FIG. 4A is asectional view of the photomask 10 along the Y direction, and FIG. 4B isa partially enlarged sectional view of the photomask 10. The Y directionin FIGS. 4A and 4B coincides with the Y direction of the above-describedsemiconductor device 1.

As illustrated in FIG. 4A, the photomask 10 includes a transparentsubstrate TS as a mask substrate, and an opaque film SD formed on thetransparent substrate TS. When the photomask 10 is used, the surface ofthe transparent substrate TS on which the opaque film SD is formed isdirected toward the photoresist film on the substrate SB, and then theexposure light is applied from the transparent substrate TS side.

The transparent substrate TS is made of, for example, quartz. Here, the“transparent” means that it is transparent to at least light having awavelength of the exposure light, and more specifically, means that theexposure light can be transmitted to such an extent that the photoresistfilm or the like is sufficiently exposed to light.

The opaque film SD is composed of, for example, chromium or the like,and blocks the exposure light to an extent that the photoresist film orthe like is not exposed to light.

As illustrated in FIG. 4B, the opaque film SD of the photomask 10 has aplurality of contact patterns C4 p as the first pattern arranged in theY direction. Each contact pattern C4 p has a sectional shape of thecontact C4 described above, and is a through-hole provided in the opaquefilm SD. The photoresist film formed on the stacked body LM isirradiated with the exposure light through the through-hole, and thephotoresist film in that portion is exposed to light and removed. Byperforming etching processing on the stacked body LM exposed by thephotoresist film or the like being removed, holes for forming thecontacts C4 are formed in the stacked body LM.

FIG. 4B illustrates a section of the photomask 10 corresponding to aportion in the vicinity of the center of, for example, one plane PN,that is, one stacked body LM in the Y direction. Within one plane PN, aplurality of contact patterns C4 p of the opaque film SD are alsoarranged in the Y direction with a predetermined distance incorrespondence with the fact that a plurality of minimum units RUarranged in the Y direction each have one contact C4 in the Y-directionsection. Each region including one contact pattern C4 p andcorresponding to the region between the two contacts LI on the substrateSB is a minimum unit RUp in the photomask 10.

Here, the distance between the geometric center CGc, which is the centerpoint of one contact pattern C4 p, and the geometric center CGc of thecontact pattern C4 p adjacent to the one contact pattern C4 p, that is,the distances PTa, PTb, . . . between the geometric centers of theadjacent contact patterns C4 p are increased as being toward the outersides in the Y direction within the region of the photomask 10corresponding to one plane PN. That is, PTa<PTb< . . . .

According to Equation (1) described above, the correction amount Δd(x,y)on the photomask 10 includes a value α (Δd₀(x,y)−Δdth) obtained bymultiplying the misalignment amount exceeding the threshold value Δdthby the ratio α. Further, in the above-described example of FIG. 3Aa, ina case where the misalignment correction is not performed, the intervalbetween the plugs CH is larger than the interval between the contactsC4. Therefore, the correction amount Δd(x,y) on the photomask 10 isincreased as being toward the outer sides in the Y direction within theplane PN, and the distances PTa, PTb, . . . between the geometriccenters have the above-described relationship.

Therefore, in the photomask 10, the distance between the geometriccenters of adjacent contact patterns C4 p differs between two positionsin the Y direction, for example. Here, the two positions in the Ydirection can be arbitrarily selected, and as long as the two positionsare within a region corresponding to the plane PN of the photomask 10,the center position and the position of the end portion of the regioncan be selected. However, in a case where two positions are selected inregions across the planes PN, it is assumed that positions other thanthose corresponding to each other between the regions are selectedrather than the same positions such as the center positions of theregions.

Further, in comparison between the photomask for forming the wirings D2and the photomask for forming the plugs CH with the photomask 10, thedistance between the geometric centers of the wiring patterns D2 p, thedistance between the geometric centers of the plug patterns CHp, and thedistance between the geometric centers of the contact patterns C4 p onthe photomasks are substantially equal in the region in the vicinity ofthe center position within the plane PN. On the other hand, the distancebetween the geometric centers of the contact patterns C4 p is increasedmore than the distance between the geometric centers of other patternsas being toward both end portions in the Y direction.

It is obvious to those skilled in the art that the configuration of thefirst embodiment is not limited to the case of using the above-describedbinary mask which is a typical photomask for forming the opaque film SDon the transparent substrate TS in photolithography.

In photolithography, a phase shift mask may be used instead of thebinary mask. The phase shift mask has a structure in which as analternative to an opaque film, a translucent film based on anappropriate optical design is formed on a transparent substrate. Thephase shift mask may be selected in a case where the exposure processmargin of lithography is larger than that of the binary mask byappropriately designing and manufacturing the optical characteristicsand film thickness of the translucent film such as the complexrefractive index.

Further, extreme ultraviolet (EUV) lithography may be used instead ofphotolithography that performs exposure using ultraviolet rays or deepultraviolet rays. The wavelength of current EUV lithography is 13.5 nmin the soft X-ray region, and there is no appropriate transparentsubstrate. For this reason, EUV lithography uses a reflective photomaskthat utilizes multiple interference of metal oxide films multi-layerstacked on the transparent substrate. A typical structure is a structurein which an opaque film pattern is formed on a multilayer stacked filmof metal oxide films. If necessary, a structure in which the multilayerfilm is dug between the opaque films may be used. Although a reflectiveoptical system is used as the optical system of the above photomask andthe exposure apparatus, EUV lithography is generally treated as one typeof photolithography, too.

Further, a nanoimprint lithography (NIL) technology may be used insteadof the photolithography technology. In NIL, a mold in which a pattern isdug on the surface is used, and specifically, a curable material isfilled between the mold and the substrate and is stamped. The mold isremoved after the curable material is cured by light or heat, and apattern is formed on the substrate surface. The point that the substrateis processed using the cured material pattern as a processing mask isthe same as in photolithography and the like.

Further, in electron beam lithography, the drawing data position of eachpattern may be corrected according to the purpose of the configurationof the first embodiment.

As described above, in the above description, the binary mask ofphotolithography can be read as the phase shift mask ofphotolithography, the reflective photomask of EUV lithography, and themold of NIL. Further, also in electron beam lithography, the drawingdata may be created for the purpose of the configuration of the firstembodiment.

In the semiconductor device such as a three-dimensional non-volatilememory, there may be differences in mechanical strength and residualstress between hierarchies, such as a mixture of structures in which aplurality of layers are arranged in a high stack, and the differencesmay be accumulated. For this reason, for example, due to the distortiondepending on the position on a plane within the plane and the change instress between different lithography processes, misalignment may occurbetween structures arranged in different hierarchies. In a case wherethese structures are interconnected, poor connection may occur.

Therefore, in order to suppress the poor connection with the structuresarranged in the upper and lower hierarchies, for example, themisalignment correction is performed for the structure arranged in theintermediate layer in accordance with the structure of the upper layeror the structure of the lower layer, in some cases.

However, in a case where the correction is performed for the structureof the intermediate layer in accordance with only the structure of theupper layer or only the structure of the lower layer, the poorconnection with the other structure may occur. In a case where the areaof the connection surface of the structure of any of the upper and lowerlayers is increased in order to maintain the connection with both theupper and lower hierarchies, the area of the plane may be increased andthe size of the semiconductor device may be increased.

According to the semiconductor device 1 of the first embodiment, in theminimum unit RU, each of the distance between the geometric centers ofthe contact C4 and the wiring D2 and the distance between the geometriccenters of the contact C4 and the plug CH differs between any twopositions in the Y direction. That is, according to the semiconductordevice 1 of the first embodiment, the position of the contact C4 iscorrected with respect to the position of the wiring D2 or the plug CHby a correction factor of less than 100°.

As a result, it is possible to suppress the poor connection betweenstructures arranged in different hierarchies. Further, for example,since the poor connection can be suppressed without increasing the sizeof the wiring D2 or the like, it is possible to reduce the size of thesemiconductor device 1.

In the above-described first embodiment, the above-described method ofperforming correction by less than 100° has been applied to theconnection structure with the contact C4, the wiring D2, and the plug CHin the penetrating contact regions TPc and TPw, the connection structurewith the contact C3, the wiring D2, and the plug VY in the peripheralregion PR, and the like in the semiconductor device 1. However, theabove-described method can be applied to other structures as long as thestructure is a structure connected to both the structures arranged inthe upper and lower hierarchies.

As an example, examples of other semiconductor devices will be given. Inthe semiconductor device, a configuration is adopted in which, forexample, a stacked body in which word lines are stacked is arranged onthe substrate, and the peripheral circuit which is covered with theinsulating layer up to the height position of the upper surface of thestacked body is arranged in the same hierarchy as the stacked body, onthe outer side of the stacked body, for example. In this case, theabove-described method of the first embodiment can be applied to thecontact which is formed by penetrating the insulating layer and connectsthe upper layer wiring and the gate or active area of the transistorincluded in the peripheral circuit.

Since stress is generated between the insulating layer that the contactpenetrates and the stacked body arranged in the same hierarchy, it ispossible to suppress the poor connection between the contact and thegate or active area, and the poor connection between the contact and theupper layer wiring by applying the above-described method.

Here, in a case where the structure of the first embodiment is appliedto the connection structure arranged in the region outside the plane PN,such as the contact C3 of the semiconductor device 1 and the contactthat connects the upper layer wiring and the peripheral circuit of theother semiconductor device, the plane PN in the above description may beread as the above-described independent operating element having aconfiguration in which the contact C3 arranged in the peripheral regionPR, the peripheral circuit CUA, and the like are added to the plane PN.

Further, in the above-described first embodiment, in the penetratingcontact regions TPc and TPw, the insulating region NR is formed byinhibiting the replacement of the sacrificial layer with the word lineWL. However, the method of securing the insulating region in the stackedbody is not limited thereto. For example, in the region corresponding tothe insulating region, the insulating region can also be formed in thestacked body by digging the stacked body before the replacement with theword line WL and embedding the insulating layer such as a silicon oxidelayer therein. Alternatively, instead of forming the insulating regionNR, the outer periphery of the conductive member of the contact C4 maybe covered with a thick insulating layer to insulate the contact C4 fromthe surrounding word line WL or the like.

First Modification Example

Next, the semiconductor device of a first modification example of thefirst embodiment will be described with reference to FIGS. 5A and 5B. Inthe following first modification example, a method of determining theratio α will be described with some examples.

FIGS. 5A and 5B are diagrams illustrating some examples of a planearrangement of the semiconductor device according to the firstmodification example of the first embodiment. FIG. 5A illustrates anexample of a case in which planes are arranged in translational symmetryin the Y direction in one semiconductor device. FIG. 5B is an example ofa case in which planes are arranged in mirror symmetry and translationalsymmetry in the Y direction in one semiconductor device.

In the example of FIG. 5A, the semiconductor device of the firstmodification example includes 16 planes within a chip region CPa of thesemiconductor device. The four chip regions CPa constitute one shotregion SHa, and in the manufacturing process of the semiconductordevice, the region including a total of 64 planes included in the fourchip regions CPa is collectively exposed and developed.

In the Y direction within one shot region SHa, for example, the stackedbody LM that tends to shrink due to contraction stress and theperipheral region PR that tends to expand due to tensile stress arealternately arranged, and the planes are arranged in translationalsymmetry, that is, periodically in the Y direction.

Therefore, in the semiconductor device of the first modification exampleillustrated in FIG. 5A, the misalignment correction may be performedusing, for example, a constant ratio α over the entire Y directionwithin one shot region SHa.

Note that a plurality of alignment marks MKd, MKr, MKs, MKc, MKh, andthe like are arranged at, for example, four corners within one shotregion SHa. These alignment marks MKd, MKr, MKs, MKc, and MKh are usedfor alignment between the photomask and the substrate SB whentransferring a pattern for forming a predetermined structure to a resistfilm.

The alignment mark MKd is a mark for forming the wirings D2, thealignment mark MKr is a mark for forming the columnar portions HR, thealignment mark MKs is a mark for forming the contacts LI, the alignmentmark MKc is a mark for forming the contacts C4, and the alignment markMKh is a mark for forming the plugs CH.

In this way, the alignment marks MKd, MKr, MKs, MKc, and MKh are formedon the substrate SB one by one for one photomask, for example.

Also in the example of FIG. 5B, the semiconductor device of the firstmodification example includes 16 planes within a chip region CPb of thesemiconductor device, and four chip regions CPb constitute one shotregion SHb.

In the Y direction within one shot region SHb, the planes are arrangedin mirror symmetry to be upside down in each row. That is, two stackedbodies LM adjacent to each other in the Y direction and two peripheralregions PR adjacent to each other in the Y direction are alternatelyarranged.

Therefore, in the semiconductor device of the first modification exampleillustrated in FIG. 5B, it is considered that the stress balance differsdepending on the position in the Y direction within one shot region SHb.In such a case, the value of the ratio α may be biased according to theposition in the Y direction within one shot region SHb or within oneplane. That is, for example, different ratios α_(IN) and α_(OUT) may beset for the end portion on a side where the two stacked bodies LM areadjacent to each other and the end portion on a side adjacent to theperipheral region PR.

Second Modification Example

Next, the semiconductor device of a second modification example of thefirst embodiment will be described with reference to FIG. 6 . In thesemiconductor device of the second modification example, a regiondifferent from that in the semiconductor device 1 of the firstembodiment described above is the minimum unit.

In the above-described first embodiment, an example in which the regionbetween the two contacts LI is the minimum unit RU in the Y directionhas been described, but the configuration corresponding to the minimumunit can be changed depending on the arrangement of variousconfigurations of the semiconductor device.

FIG. 6 is a diagram illustrating an example of a minimum unit RUx of thesemiconductor device according to the second modification example of thefirst embodiment. As illustrated in FIG. 6 , in the semiconductor deviceof the second modification example, a region in which four regions RUaand RUb each of which is between two contacts LI are arranged in the Ydirection corresponds to the minimum unit RUx.

The semiconductor device of the second modification example includes aconfiguration STR-A, a configuration STR-B, and configurations STR-Ca orSTR-Cb between the two contacts LI. In a case where the arrangementorder of these configurations in the X direction differs in the regionsRUa and RUb each of which is between the two contacts LI, in a case ofhaving a configuration arranged across one contact LI, or the like, aregion in which a plurality of regions each of which is between the twocontacts LI are arranged in the Y direction can be the minimum unit.

In the semiconductor device of the second modification example, in theregion RUa, the configurations are arranged in order of theconfiguration STR-A, the configuration STR-B, and the configurationsSTR-Ca or STR-Cb from the right side of the paper. On the other hand, inthe region RUb, the configurations are arranged in order of theconfiguration STR-A, the configurations STR-Ca or STR-Cb, and theconfiguration STR-B from the right side of the paper. In addition, theconfigurations STR-Ca and STR-Cb are arranged across one contact LI.

As a result, in the semiconductor device of the second modificationexample, the four regions RUa, RUa, RUb, and RUb arranged in the Ydirection constitute one minimum unit RUx.

Therefore, in a case where the correction method of the first embodimentis applied to the semiconductor device of the second modificationexample, regarding the structure of each of the upper layer, theintermediate layer, and the lower layer, in the minimum unit RUx, eachof the distance between the geometric centers of the structure of theintermediate layer and the structure of the lower layer, and thedistance between the geometric centers of the structure of theintermediate layer and the structure of the upper layer differs betweenany two positions in the Y direction.

The above-described configuration STR-A may be, for example, a memoryregion. The configuration STR-B may be, for example, a penetratingcontact region. The configurations STR-Ca and STR-Cb may be, forexample, a staircase region arranged in the central region rather thanin the end portion of the stacked body. In a case where the staircaseregion is arranged in the central region of the stacked body, theconfigurations STR-Ca and STR-Cb are arranged across, for example, thetwo regions RUa and RUa or the two regions RUb and RUb by digging thestacked body into a mortar-like shape, leading out the word lines ofeach layer in a staircase pattern, and separating those by the contactsLI.

Second Embodiment

Hereinafter, a second embodiment will be described in detail withreference to the drawings. The second embodiment is different from thefirst embodiment in that the misalignment correction is performed on aplurality of structures arranged in the same hierarchy.

(Configuration Example of Semiconductor Device)

The semiconductor device of the second embodiment will be described byborrowing FIGS. 1A, 1B, and 2 of the above-described first embodiment.As illustrated in FIGS. 1A, 1B, and 2 to be borrowed, the semiconductordevice of the second embodiment also has, for example, the sameconfiguration as the semiconductor device 1 of the above-described firstembodiment.

However, in the semiconductor device of the second embodiment, forexample, the slits for forming the contacts LI as the second structureand the holes for forming the contacts C4 as the first structure arecollectively formed in the same photolithography process.

That is, in the semiconductor device of the second embodiment, in orderto form the contacts C4, and the wirings D2 as the third structure andthe plugs CH as the fourth structure which are connected to upper andlower ends of the contacts C4, a total of three types of photomaskswhich are a photomask for forming the wirings D2, a photomask forforming the contacts C4 and the contacts LI, and a photomask for formingthe plugs CH are used. The photomask for forming the plugs CH to beconnected to the contacts C4 is also a photomask for forming the plugsCH as the fifth and sixth structures to be connected to the contacts LIand the pillars PL, respectively.

At this time, as described above, the contact C4 may have poorconnection with the wiring D2 and the plug CH due to the misalignment.Since the contact LI is also connected to the plug CH as describedabove, the poor connection with the plug CH may occur due to themisalignment of the contact LI. Further, the misalignment of the contactLI may cause contact between the contact LI and the adjacent pillar PLin the memory region MR.

Therefore, in the semiconductor device of the second embodiment, forexample, the misalignment correction with respect to the plug CH isperformed for both the contact C4 and the contact LI.

Here, as described above, since the upper surface of the pillar PL isconnected to the plug CH, the misalignment correction is performed suchthat, for example, the positions of the geometric centers of the pillarPL and the plug CH substantially overlap with each other. Therefore, bycorrecting the misalignment of the contacts LI with respect to the plugsCH, it is possible to indirectly correct the misalignment between thecontacts LI and the pillars PL.

(Example of Misalignment Correction of Semiconductor Device)

FIGS. 7Aa to 7Cb are diagrams for describing misalignment correctionusing the photomask of the second embodiment. Examples of FIGS. 7Aa to7Cb illustrate a case where the positions of the contacts C4 withrespect to the plugs CH are not corrected, a case where the positions ofthe contacts C4 with respect to the plugs CH are 100% corrected, and acase where the positions of the contacts C4 with respect to the plugs CHare 40% corrected.

In the following description, in order to distinguish the contacts C4and LI from each other, the configuration relating to the contact LIwill be described as a slit ST. This is because a slit pattern STp onthe photomask is transferred to the stacked body LM to form the slit ST,and the slit ST is filled to form the contact LI.

Further, in FIGS. 7Aa to 7Cb, the configurations of the wiring patternD2 p, the contact pattern C4 p, and the plug pattern CHp on thephotomasks and the positional relationship and the misalignment amountamong the wiring D2, the contact C4, and the plug CH on the substrate SBof a case where the positions of the contacts C4 with respect to theplugs CH are not corrected, a case where the positions of the contactsC4 with respect to the plugs CH are 100% corrected, and a case where thepositions of the contacts C4 with respect to the plugs CH are 40%corrected are the same as those in the examples of FIGS. 3Aa to 3Cb ofthe above-described first embodiment.

Therefore, in the following description, the positional relationshipbetween the contact pattern C4 p and the slit pattern STp on thephotomask, and the positional relationship and the misalignment amountbetween the contact C4 and the slit ST on the substrate SB will bemainly described.

FIG. 7Aa is a diagram schematically illustrating a top view ofphotomasks in which the misalignment of the contacts C4 and the slits STwith respect to the plugs CH is not corrected, and a top view and asectional view of each structure formed in a case of using thephotomasks. In FIG. 7Aa, the top views of the photomasks and eachstructure schematically illustrate a state of one end portion in the Ydirection within the plane PN, a center portion within the plane PN, andthe other end portion in the Y direction within the plane PN, from theupper side in the vertical direction.

As illustrated in FIG. 7Aa, in the photomask for forming the contacts C4and the slits ST, similar to the contact patterns C4 p, the slitpatterns STp are also arranged at substantially equal intervals in the Ydirection in one plane PN, and the positions of the geometric centersthereof also substantially match those of the wiring pattern D2 p andthe plug pattern CHp.

Here, two slit patterns STp are included within the region correspondingto the minimum unit RU in the photomask. Therefore, the position of thegeometric center of the slit pattern STp is the position of thegeometric center of the entirety of two slit patterns STp. That is, theposition of the geometric center of the two slit patterns STp is thecenter position of the two slit patterns STp in the Y direction.

When these photomasks are used to sequentially form the wirings D2, thecontacts C4, the slits ST, and the plugs CH on the substrate SB, sincethe contacts C4 and the slits ST are arranged in the same hierarchy andhave substantially the same misalignment amount, the positionalrelationships of the contact C4 and the slit ST with respect to the plugCH are substantially equal over the entire position in the Y directionwithin the plane PN.

Referring to the A-A section of one end portion of the plane PN in the Ydirection, the slits ST on both sides of the contact C4 in the Ydirection are arranged substantially equidistant with respect to thecontact C4, but are misaligned with respect to the plug CH.

FIG. 7Ab is a graph schematically illustrating the misalignment amountof each structure in a case of using the photomasks in which themisalignment of the contacts C4 and the slits ST with respect to theplugs CH is not corrected. The horizontal axis of the graph is the Ycoordinate position in the plane PN, and the vertical axis is themisalignment amount in the Y direction.

As illustrated in FIG. 7Ab, the misalignment amount MSs between the slitST and the plug CH substantially matches the misalignment amount MStbetween the contact C4 and the plug CH over the entire position in the Ydirection within the plane PN.

FIG. 7Ba is a diagram schematically illustrating a top view ofphotomasks in which the misalignment of the contacts C4 and the slits STwith respect to the plugs CH is 100% corrected, and a top view and asectional view of each structure formed in a case of using thephotomasks.

As illustrated in FIG. 7Ba, the contact patterns C4 p and the slitpatterns STp on the photomask for forming the contacts C4 and the slitsST are 100% corrected in accordance with the positions of the plugs CHon the substrate SB in the actual semiconductor device 1.

As a result, the interval between the contact patterns C4 p and theinterval between the slit patterns STp on the photomask are increasedmore than the interval between the wiring patterns D2 p and the intervalbetween the plug patterns CHp on other photomasks as being toward thepositions corresponding to both sides of the plane PN in the Ydirection.

In this manner, when the photomasks are superposed, the positions of thegeometric centers of the wiring patterns D2 p and the plug patterns CHpsubstantially match at any position in the Y direction within the planePN, and the positions of the geometric centers of the contact patternsC4 p and the slit patterns STp are shifted outward in the Y direction asbeing toward both sides in the Y direction within the plane PN.

At this time, the interval between the contact patterns C4 p and theinterval between the slit patterns STp are increased with a correlation,and the intervals between the positions of the geometric centers of thecontact patterns C4 p and the positions of the geometric centers of theslit patterns STp within one minimum unit RU substantially match overthe entire Y direction in the plane PN.

When these photomasks are used to sequentially form the wirings D2, thecontacts C4, the slits ST, and the plugs CH on the substrate SB, sincethe positions of the contacts C4 and the slits ST are adjusted to matchthe positions of the plugs CH, the plug CH is connected to thesubstantially center position of the contact C4, and is arranged atsubstantially center position between two slits ST within one minimumunit RU over the entire position in the Y direction within the plane PN.As a result, it is considered that the plug CH is also connected to thecontact LI itself at a position (not illustrated) with almost nomisalignment. It is also considered that the contact between the slit STand the pillar PL is suppressed.

Referring to the A-A section of one end portion of the plane PN in the Ydirection, the plug CH is also arranged at the substantially centerposition of the contact C4 and the slits ST.

FIG. 7Bb is a graph schematically illustrating the misalignment amountof each structure in a case of using the photomasks in which themisalignment of the contacts C4 and the slits ST with respect to theplugs CH is 100% corrected.

As illustrated in FIG. 7Bb, the misalignment amount MSs between the slitST and the plug CH has the lowest value over the entire position in theY direction in the plane PN, similar to the misalignment amount MStbetween the contact C4 and the plug CH.

FIG. 7Ca is a diagram schematically illustrating a top view ofphotomasks in which the misalignment of the contacts C4 with respect tothe plugs CH is 40% corrected, and a top view and a sectional view ofeach structure formed in a case of using the photomasks. On the otherhand, since the tolerance of the misalignment amount between the slit STand the pillar PL is small, the misalignment of the slit ST with respectto the plug CH is 100% corrected, for example.

As illustrated in FIG. 7Ca, the slit patterns STp on the photomask forforming the contacts C4 and the slits ST are 100% corrected inaccordance with the positions of the plugs CH on the substrate SB in theactual semiconductor device 1.

As a result, the interval between the slit patterns STp on the photomaskis increased more than the interval between the contact patterns C4 pwhich are corrected by less than 100% in accordance with the positionsof the plugs CH on the substrate SB in the actual semiconductor device1, as being toward the positions corresponding to both sides of theplane PN in the Y direction.

In this manner, the positions of the geometric centers of the slitpatterns STp are shifted outward in the Y direction more than thepositions of the geometric centers of the contact patterns C4 p as beingtoward both sides in the Y direction within the plane PN. Therefore, thedistance between the geometric centers of the contact pattern C4 p andthe slit pattern STp within one minimum unit RU is increased as beingtoward both sides of the plane PN in the Y direction.

Among the photomasks for forming the contacts C4 and the slits STillustrated in FIGS. 7Aa, 7Ba, and 7Ca, the photomask illustrated inFIG. 7Ca corresponds to the photomask of the second embodiment.

When these photomasks illustrated in FIG. 7Ca are used to sequentiallyform the wirings D2, the contacts C4, the slits ST, and the plugs CH onthe substrate SB, although the center positions of the contacts C4 andthe plugs CH do not perfectly match over the entire position in the Ydirection within the plane PN, the center positions of the slits ST andthe plugs CH substantially match over the entire position in the Ydirection within the plane PN.

Referring to the A-A section of one end portion of the plane PN in the Ydirection, the plug CH is slightly shifted outward in the Y directionfrom the center position of the contact C4, but is arranged at thesubstantially center of the two slits ST in the minimum unit RU.

FIG. 7Cb is a graph schematically illustrating the misalignment amountof each structure in a case of using the photomasks in which themisalignment of the contacts C4 with respect to the plugs CH is 40%corrected and the misalignment of the slits ST with respect to the plugsCH is 100% corrected.

As illustrated in FIG. 7Cb, the misalignment amount MSs between the slitST and the plug CH has the lowest value over the entire position in theY direction in the plane PN.

In addition, in FIGS. 7Ab, 7Bb, and 7Cb described above, the change inmisalignment amount between the structures in the Y direction isrepresented by a linear graph, but each of the graphs is merely aschematic graph.

As in the correction method of the second embodiment, it is possible tocorrect a plurality of correction target structures such as the contactC4 and the slit ST with different correction amounts on the basis of thetolerance of misalignment of each of the plurality of correction targetstructures. More specifically, the contact C4 is corrected on the basisof Equation (1) described above. The ratio α in Equation (1) is anumerical value less than 1.

Further, the slit ST is corrected on the basis of Equation (2) describedbelow as the correction amount Δd′(x,y) in a case where the correctionamount Δd₀′(x,y) at the time of 100% correction of the slits ST withrespect to the plugs CH is equal to or greater than the threshold valueΔdth′.Δd′(x,y)=Δdth′+β(Δd ₀′(x,y)−Δdth′)  (2)

Here, in the above-described example a ratio β is 1, but more generally,the ratio β may be a numerical value less than 1 which is different fromthe ratio α The ratio β is determined on the basis of, for example, themisalignment amount between the slit ST and the plug CH on the actualsubstrate SB, the misalignment amount between the slit ST and the pillarPL on the actual substrate SB, and the value of the tolerance of thesemisalignment amounts.

Further, as in the case of Equation (1), Equation (2) described abovemay be a higher-order equation. Further, in a case where themisalignment amount, the tendency of misalignment, and the like differbetween the X direction and the Y direction within the plane PN,different ratios β may be used for the X direction and the Y direction.

The contacts C4 are formed using Equation (1) described above, so thatthe semiconductor device of the second embodiment also has at least oneof the following configurations.

That is, the misalignment amount between the contact C4 and the wiringD2 and the misalignment amount between the contact C4 and the plug CHhave a correlation. In addition, a predetermined amount of misalignmentother than zero occurs between the contact C4 and the wiring D2, andbetween the contact C4 and the plug CH.

The contacts C4 are formed using Equation (1) described above and theslits ST are formed using Equation (2) described above, so that thesemiconductor device of the second embodiment has at least one of thefollowing configurations.

That is, the contact C4 and the contact LI have a relationship such thatthe distance between the geometric centers of the contact C4 and thecontact LI within one minimum unit RU is increased as being toward bothsides in the Y direction within one plane PN.

In such a case, the distance between the geometric centers of thecontact C4 and the contact LI within one minimum unit RU differs betweentwo positions in a predetermined direction such as the X direction orthe Y direction. Here, the two positions in the predetermined directioncan be arbitrarily selected, and for example, within the plane PN, thecenter position and the position of the end portion of the plane PN canbe selected. However, in a case where two positions are selected acrossthe planes PN, it is assumed that positions other than thosecorresponding to each other between the planes PN are selected ratherthan the same positions such as the center positions of the planes PN.

In addition, by correcting the contacts C4 with respect to the plugs CHby less than 100% and correcting the slits ST with respect to the plugsCH by 100%, the misalignment amount between the positions of thegeometric centers of the contact C4 and the contact LI within oneminimum unit RU is substantially equal to the misalignment amountbetween the contact C4 and the plug CH.

However, the misalignment amount of these structures may include themisalignment amount due to processes such as overlay (superposing)misalignment between different lithography processes, in addition to themisalignment amount affected by the stress.

As in the semiconductor device of the second embodiment, the fact thatthe contacts C4 and the contacts LI are collectively formed in the samephotolithography process can be determined by, for example, analyzingthe alignment mark remaining on the semiconductor device.

That is, among the alignment marks MKd, MKr, MKs, MKc, MKh, and the likeillustrated in FIGS. 5A and 5B described above, the fact that thealignment marks MKc and MKs for the contact C4 and the contact LI areintegrated can be treated as a proof of the collective formation of thecontacts C4 and the contacts LI.

The positional relationship between the contact C4 and the wiring D2,the positional relationship between the contact C4 and the plug CH, thepositional relationship between the contact C4 and the contacts LI, andthe like may be the positional relationships in a case where the upperend of the contact C4, the upper surface of the wiring D2, the upper endof the plug CH, and the upper ends of the contacts LI are compared.

Further, since two contacts LI are included within one minimum unit RU,the position of the geometric center of the contact LI is the positionof the geometric center of the entirety of the two contacts LI asdescribed above. Within one minimum unit RU, even in a case where aplurality of other structures are arranged within one minimum unit RU asin a case where a plurality of contacts C4 are arranged not only in theX direction but also in the Y direction, the position of the geometriccenter described above may be the position of the geometric center inthe entirety of the plurality of structures thereof.

Further, in a case where the contacts C4 are formed using Equation (1)described above and the slits ST are formed using Equation (2) describedabove, the photomask of the second embodiment has, for example, theconfiguration illustrated in FIGS. 8A and 8B below.

FIGS. 8A and 8B are schematic views illustrating an example of aconfiguration of a photomask 20 used in forming the contacts C4 and theslits ST of the semiconductor device according to the second embodiment.FIG. 8A is a sectional view of the photomask 20 along the Y direction,and FIG. 8B is a partially enlarged sectional view of the photomask 20.The Y direction in FIGS. 8A and 8B coincides with the Y direction of thesemiconductor device of the second embodiment.

Further, FIGS. 8A and 8B illustrate an example of a case in which theratio β in Equation (2) is larger than the ratio α in Equation (1) (β≤1,α<β). That is, it is assumed that the correction amount of misalignmentof the slit ST with respect to the plug CH is set to be larger than thecorrection amount of misalignment of the contact C4 with respect to theplug CH.

As illustrated in FIG. 8A, the photomask 20 also includes thetransparent substrate TS as a mask substrate, and the opaque film SDformed on the transparent substrate TS.

As illustrated in FIG. 8B, the opaque film SD of the photomask 20 has aplurality of contact patterns C4 p as the first pattern arranged in theY direction, and a plurality of slit patterns STp as the second patternarranged in the Y direction. The contact pattern C4 p is a through-holeprovided in the opaque film SD, and the slit pattern STp is athrough-groove extending in the X direction provided in the opaque filmSD.

FIG. 8B illustrates a section of the photomask 20 corresponding to aportion in the vicinity of the center of, for example, one plane PN,that is, one stacked body LM in the Y direction, and a region betweentwo slit patterns STp arranged on both sides in the Y direction with onecontact pattern C4 p interposed therebetween corresponds to the minimumunit RUp in the photomask 20.

Here, the configuration of the contact pattern C4 p in the photomask 20is the same as the configuration of the contact pattern C4 p in thephotomask 10 of the first embodiment described above.

In the photomask 20, the distance between the geometric center CGs ofthe slit pattern STp within one minimum unit RUp and the geometriccenter CGs of the slit pattern STp within the adjacent minimum unit RUp,that is, the distances PTm, PTn, . . . between the geometric centers ofthe slit patterns STp within the adjacent minimum units RUp areincreased as being toward the outer sides in the Y direction within theregion of the photomask 20 corresponding to one plane PN. That is,PTm<PTn< . . . .

Further, within one plane PN, the distances PTm, PTn, . . . between thegeometric centers of the slit patterns STp are larger than the distancesPTa, PTb, . . . between the geometric centers of the contact patterns C4p. That is, PTa<PTm, PTb<Ptn . . . .

As a result, the distances between the geometric centers CGc of thecontact patterns C4 p and the geometric centers CGs of the slit patternsSTp within one minimum unit RUp, that is, the distances DSa, DSb, DSc, .. . between the geometric centers of the contact patterns C4 p and theslit patterns STp are increased as being toward the outer sides in the Ydirection within the region of the photomask 20 corresponding to theplane PN on the substrate SB. That is, DSa<DSb<DSc . . . .

Therefore, in the photomask 20, the distance between the geometriccenters of the contact pattern C4 p and the slit pattern STp differsbetween two positions in the Y direction, for example. Here, the twopositions in the Y direction can be arbitrarily selected, and as long asthe two positions are within the region corresponding to the plane PN ofthe photomask 20, the center position and the position of the endportion of the region can be selected. However, in a case where twopositions are selected in regions across the planes PN, it is assumedthat positions other than those corresponding to each other between theregions are selected rather than the same positions such as the centerpositions of the regions.

Further, in comparison between the photomask for forming the wirings D2and the photomask for forming the plugs CH with the photomask 20, thedistance between the geometric centers of the wiring patterns D2 p, thedistance between the geometric centers of the plug patterns CHp, thedistance between the geometric centers of the contact patterns C4 p, andthe distance between the geometric centers of the slit patterns STp onthe photomasks are substantially equal in the region in the vicinity ofthe center position within the plane PN. On the other hand, the distancebetween the geometric centers of the contact patterns C4 p is increasedmore than the distances between the geometric centers of other patternson the other photomasks as being toward both end portions in the Ydirection, and the distance between the geometric centers of the slitpatterns STp is increased more than the distance between the geometriccenters of the contact patterns C4 p as being toward both end portionsin the Y direction.

The configuration of the second embodiment is not limited to the binarymask as described above, and can be applied to the phase shift mask, thereflective photomask of EUV lithography, the mold of NIL, drawing dataused for electron beam lithography, and the like.

According to the semiconductor device of the second embodiment, in theminimum unit RU, the distance between the geometric centers of thecontact C4 and the contact LI differs between any two positions in the Ydirection. That is, according to the semiconductor device of the secondembodiment, the contact C4 and the contact LI are corrected with respectto the position of the plug CH by using different ratios α and β.

As a result, it is possible to suppress the poor connection betweenstructures arranged in different hierarchies. Further, even in a casewhere structures such as the contact C4 and the contact LI, havingdifferent tolerances with respect to a common connection target such asthe plug CH are collectively formed, the misalignment correction can beperformed with correction amounts suitable for the respectivestructures.

According to the photomask 20 of the second embodiment, in the minimumunit RUp, the distance between the geometric centers of the contactpattern C4 p and the slit pattern STp differs between any two positionsin the Y direction. As a result, it is possible to suppress the poorconnection between structures arranged in different hierarchies, and itis possible to perform misalignment correction with correction amountssuitable for the respective structures.

In the above-described second embodiment, in a case where the contactsC4 and LI to be connected to the plug CH are collectively formed, thecontacts C4 and LI are corrected by different ratios.

However, the above correction method may be applied even in a case wherea structure in which the slit ST is filled with an insulating layer orthe like is formed from the slit ST collectively formed with the contactC4. In this case, although the structure formed from the slit ST is notconnected to the plug CH, it is desirable that the contact between thestructure and the pillar PL of which the misalignment with respect tothe plug CH is corrected is suppressed, and it is preferable that themisalignment of the structure with respect to the plug CH is correctedat a predetermined ratio.

In addition, one or both of the plate-like portions BR as the secondstructure at both end portions of the insulating region NR where thecontacts C4 are arranged and the plate-like portion BP as the secondstructure on the outer side of the stacked body LM (refer to FIG. 1A)may be collectively formed in the same photolithography process togetherwith the contact C4 and the contact LI. Even in this case, themisalignment of the contact LI, the plate-like portion BR, and theplate-like portion BP can be corrected at different ratios.

Further, the contact C4 may be collectively formed with, for example,the columnar portion HR in the same photolithography process. It ispreferable that the contact between the columnar portion HR and thecontact LI is suppressed, and it is preferable that the contact betweenthe columnar portion HR and the contact CC in the staircase region SR issuppressed. Therefore, in order to suppress the contact with thesecontacts LI and CC, the misalignment of the columnar portion HR withrespect to the plug CH can be corrected at a predetermined ratio, forexample.

Further, the contact C4 may be not only the contact C4 in thepenetrating contact region TPc as in the above example, but also thecontact C4 arranged in the penetrating contact region TPw. Further, theabove correction method may be applied even in a case where, in place ofor in addition to the contact C4, the above-described contact C3, thecontact LI and the plate-like portions BR and BP, and the like as thesecond structure are collectively formed. In this case, the plane PN inthe above description can be read as an independent operating elementincluding a configuration such as the contact C3 in addition to theplane PN.

As described above, the correction method of the second embodiment canbe applied to, for example, a case where a structure to be connected tostructures arranged in the upper and lower hierarchies and a structureto be connected to a structure arranged in one of the upper and lowerhierarchies are collectively formed in the same photolithographyprocess. Further, the correction method of the second embodiment can beapplied to, for example, a case where a structure to be connected tostructures arranged in the upper and lower hierarchies and a structurearranged with an interval from another structure in the same hierarchyare collectively formed in the same photolithography process.

Modification Example

Next, the configuration of the modification example of the secondembodiment will be described using FIGS. 9Aa to 9Bb. The configurationof the modification example is different from the above-described secondembodiment in that among the contacts C4 and the slits ST, themisalignment of the contacts C4 is not corrected and the misalignment ofthe slits ST is corrected.

FIGS. 9Aa to 9Bb are diagrams for describing misalignment correctionusing a photomask of the modification example of the second embodiment.

FIGS. 9Aa and 9Ab illustrate an example of a case where the misalignmentof the contacts C4 and the slits ST with respect to the plugs CH is notcorrected.

As illustrated in FIGS. 9Aa and 9Ab, the contact C4 is misaligned withrespect to the wiring D2 and the plug CH, but both the misalignmentamounts MSt and MSb thereof are within the designed tolerances AVt andAVb.

On the other hand, the slit ST is misaligned with respect to the plugCH, and the misalignment amount MSs thereof exceeds the designedtolerance AVs.

In such a case, the misalignment of the slit ST is corrected on thebasis of Equation (2) described above, but the misalignment of thecontact C4 may not be corrected.

FIGS. 9Ba and 9Bb illustrate an example of a case where the misalignmentof the contacts C4 with respect to the plugs CH is not corrected and themisalignment of the slits ST with respect to the plugs CH is corrected.In FIGS. 9Ba and 9Bb, the slits ST are 100% corrected in considerationof the tolerance AVs of the misalignment amount MSs between the slit STand the plug CH.

In such a process, all of the misalignment amount MSt between thecontact C4 and the plug CH, the misalignment amount MSb between thecontact C4 and the wiring D2, and the misalignment amount MSs betweenthe slit ST and the plug CH can be within the tolerances AVt, AVb, andAVs, respectively.

In the photomasks used in such a process, the relative relationshipssuch as the distance between the geometric centers of the slit patterns,the distance between the geometric centers of the contact pattern andthe slit pattern, and the like are similar to those in the photomask 20of the second embodiment.

In the semiconductor device manufactured by such a process, the relativepositional relationships of the respective configurations such as thecontact C4, the slit ST, the plug CH, and the wiring D2 are similar tothose in the semiconductor device of the second embodiment.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A semiconductor device comprising: first andsecond structures arranged in a first hierarchy, the first and secondstructures being repeatedly arranged in a first direction along a planeof the first hierarchy, a third structure that is repeatedly arranged inthe first direction in a second hierarchy which is a lower layer of thefirst hierarchy; and a fourth structure that is repeatedly arranged inthe first direction in a third hierarchy which is an upper layer of thefirst hierarchy, wherein a distance between geometric centers of thefirst and second structures in a minimum unit of repetition of the firstand second structures differs at a first position and a second positionin the first direction, the minimum unit includes the third and fourthstructures, and in the minimum unit, each of a distance betweengeometric centers of the first and third structures and a distancebetween geometric centers of the first and fourth structures differs atthe first position and the second position.
 2. The semiconductor deviceaccording to claim 1, wherein the first hierarchy includes a memoryregion in which a plurality of memory cells are three-dimensionallyarranged, and the distance between the geometric centers of the firstand second structures is increased as being toward an end portion of thememory region in the first direction from a center of the memory region.3. The semiconductor device according to claim 1, wherein in the minimumunit, a distance between geometric centers of the second and fourthstructures is substantially constant over the first direction.
 4. Thesemiconductor device according to claim 1, wherein the distance betweenthe geometric centers of the first and second structures in the minimumunit and the distance between the geometric centers of the first andfourth structures in the minimum unit are substantially equal within thesame minimum unit.
 5. The semiconductor device according to claim 1,wherein the third and fourth structures are electrically connected viathe first structure, and the second structures are arranged with thefirst structure interposed between the second structures in the firstdirection within the minimum unit.
 6. The semiconductor device accordingto claim 1, wherein a stacked body in which a plurality of conductivelayers are stacked via an insulating layer is arranged in the firsthierarchy, the stacked body including a plurality of three-dimensionallyarranged memory cells, and a peripheral circuit that contributes to anoperation of the plurality of memory cells is arranged in a lower layerof the second hierarchy.
 7. The semiconductor device according to claim6, wherein the first structure is a contact that penetrates the stackedbody in a stacking direction of the stacked body and electricallyconnects one of the plurality of conductive layers and the peripheralcircuit.
 8. The semiconductor device according to claim 6, wherein thesecond structure is a source line contact that penetrates the stackedbody in a stacking direction of the stacked body.
 9. The semiconductordevice according to claim 6, wherein the second structure is aplate-like portion that is provided to secure an insulating region inthe stacked body and penetrates the stacked body in a stacking directionof the stacked body.
 10. The semiconductor device according to claim 6,wherein the third structure is a wiring that is electrically connectedto the peripheral circuit, and the fourth structure is a plug that iselectrically connected to one of the plurality of conductive layers. 11.A semiconductor device comprising: a stacked body which is arranged in afirst hierarchy, and in which a plurality of conductive layers arestacked via an insulating layer, the stacked body including a pluralityof three-dimensionally arranged memory cells; a plurality of contactswhich penetrate the stacked body in a stacking direction of the stackedbody and are repeatedly arranged in a first direction along a plane ofthe first hierarchy; a plurality of wirings which are repeatedlyarranged in the first direction in a second hierarchy that is a lowerlayer of the first hierarchy, and are each electrically connected to acorresponding contact among of the plurality of contacts; a peripheralcircuit which is arranged in a lower layer of the second hierarchy andcontributes to an operation of the plurality of memory cells; and aplurality of plugs which are repeatedly arranged in the first directionin a third hierarchy that is an upper layer of the first hierarchy, andare each electrically connected to a corresponding contact among of theplurality of contacts, wherein in a minimum unit of repetition of thecontact, the wiring, and the plug, at least one of a first distancebetween geometric centers of the contact and the wiring and a seconddistance between geometric centers of the contact and the plug differsat a first position and a second position in the first direction, and adiscontinuous point where a change tendency of the at least one of thefirst distance and the second distance is discontinuous is presentbetween the first position and the second position, the change tendencykeeping one of an increasing tendency and a decreasing tendency and notincluding the other of the increasing tendency and the decreasingtendency between the first position and the discontinuous point andbetween the discontinuous point and the second position.
 12. Thesemiconductor device according to claim 11, wherein the first hierarchyincludes a memory region in which the plurality of memory cells arethree-dimensionally arranged, and each of the first distance and thesecond distance is increased as being toward an end portion of thememory region in the first direction from a center of the memory region.13. A photomask comprising: a mask substrate; and first and secondpatterns arranged on the mask substrate, wherein the first and secondpatterns are repeatedly arranged in a first direction along a plane ofthe mask substrate, a distance between geometric centers of the firstand second patterns in a minimum unit of repetition of the first andsecond patterns differs at a first position and a second position in thefirst direction, and the second patterns are arranged with the firstpattern interposed between the second patterns in the first directionwithin the minimum unit.
 14. The photomask according to claim 13,wherein a first hierarchy of a semiconductor device which is a transfertarget of the first and second patterns includes a memory region inwhich a plurality of memory cells are three-dimensionally arranged, andthe distance between the geometric centers is increased from a positioncorresponding to a center of the memory region toward a positioncorresponding to an end portion of the memory region in the firstdirection.
 15. The photomask according to claim 13, wherein the secondpattern has a longitudinal direction in a second direction thatintersects the first direction along the plane of the mask substrate.16. The photomask according to claim 13, wherein in a first hierarchy ofa semiconductor device which is a transfer target of the first andsecond patterns, a stacked body in which a plurality of conductivelayers are stacked via an insulating layer is arranged, the stacked bodyincluding a plurality of three-dimensionally arranged memory cells. 17.The photomask according to claim 16, wherein the first pattern is apattern for transferring a hole that penetrates the stacked body in astacking direction of the stacked body, to the first hierarchy.
 18. Thephotomask according to claim 16, wherein the second pattern is a patternfor transferring a slit that separates the stacked body in a directionintersecting a stacking direction of the stacked body to form a block ofthe semiconductor device, to the first hierarchy.